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Semiconductor Manufacturing International (SMIC) and Leadcore Technology have jointly announced that SMIC's 28nm HKMG process will be ready for mass production for Leadcore's smartphone chips. A Leadcore 28nm SoC has been verified in SMIC's silicon and is ready for production.
"Following the successful adoption by mainstream smartphones of the chips based on SMIC's 28nm PolySiON process, our 28nm HKMG process has also been highly recognized by end customers and is ready for commercial use," said SMIC CEO Tzu-Yin Chiu in a statement. "We will continue to develop and improve 28nm derivative technology platforms and expect to introduce an enhanced compact version of 28nm HKMG process at the end of 2016, and provide more optimized processes to customers."
Also in the same statement, Qian Guoliang, GM of Leadcore noted the company's alliance with SMIC will enable it to deliver cost performance products and better serve the smartphone, smart car and robot markets, and will support the nation's "Made in China 2025" strategy. "In the future, we will further strengthen our cooperation with SMIC and develop high-performance chip products based on more advanced technology nodes."
In other news, SMIC is scheduled to hold a conference call on February 19 to announce its financial results for the fourth quarter of 2015 and business outlook for first-quarter 2016.